Area Array Package Design: Techniques in High Density Electronics Ken Gilleo

ISBN: 9780071428279

Published: October 24th 2003

Hardcover

204 pages


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Area Array Package Design: Techniques in High Density Electronics  by  Ken Gilleo

Area Array Package Design: Techniques in High Density Electronics by Ken Gilleo
October 24th 2003 | Hardcover | PDF, EPUB, FB2, DjVu, AUDIO, mp3, ZIP | 204 pages | ISBN: 9780071428279 | 6.69 Mb

This engineering reference covers new techniques in electronic packaging - flip chip, BGA, and MEMs. It includes high density packaging and cleaning options.



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